![]() Several obstacles can only be overcome by introducing new or revised methods, such as tighter thermal profiles and extreme precision during PCBA rework procedures 7.Ī heat shield is used to avoid thermal or mechanical damage to the component, printed circuit board (PCB), adjacent rework component locations, and solder joints. In high-density product design, multiple BGA components are placed close to each other hence, the adjacent rework component locations have a high risk of being exposed to thermal reflows during rework 6. The combination of the higher operating temperature requirements of lead-free soldering and the sensitive nature of area-array components makes defining a rework procedure for lead-free BGA components difficult 5. The solder joints are concealed beneath the component body making the rework of area-array devices more challenging 4. The process of reworking ball grid array (BGA) components is known as an area array rework. The main advantage of reworking a PCBA is that depending on the extent of damage, it can be performed faster than replacing it 3. PCBA rework is becoming increasingly crucial in times of difficulty in obtaining components, increased demand for flexibility, and short product development cycles for the product to be ready for the market 1, 2. Printed circuit board assembly (PCBA) rework is frequently used in the manufacturing industry as a beneficial effort to reduce waste and as a result, to boost total company revenue. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 ☌ and 210 ☌, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. ![]() Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. ![]() The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly.
0 Comments
Leave a Reply. |